Sierra Wireless Writing an embedded application loader Specifikace Strana 65
- Strana / 110
- Tabulka s obsahem
- KNIHY
Hodnocené. / 5. Na základě hodnocení zákazníků
Mechanical and Environmental Specifications
Rev 8 Apr.14 Proprietary and Confidential - Contents subject to change 65
Specific areas requiring heat dissipation are shown in Figure 7-4:
• RF—Top and bottom faces of module near RF connectors. Likely to be the
hottest area.
• Baseband—Top and bottom faces of module, below the RF area.
To enhance heat dissipation:
• Maximize airflow over/around the module.
• Locate the module away from other hot components.
• Module mounting holes must be used to attach (ground) the device to the
main PCB ground or a metal chassis.
• You may need to add a heat sink that mounts the module to the main PCB
(thermal compound or pads must be used between the module and the heat
sink).
• You may also need active cooling to pull heat away from the module.
Note: Adequate dissipation of heat is necessary to ensure that the module functions
properly.
Module integration testing
When testing your integration design:
• Test to your worst case operating environment conditions (temperature and
voltage)
• Test using worst case operation (transmitter on 100% duty cycle, maximum
power)
• Monitor temperature at all shield locations. Attach thermocouples to the areas
indicated in Figure 7-4 on page 64 (Baseband, RF).
• Monitor the module’s internal temperature using the command
AT!PCTEMP.
(See [2] AirPrime MiniCard MC73xx/MC8805 AT Command Reference
(Doc# 4114486).)
Note: Make sure that your system design provides sufficient cooling for the module—
proper mounting, heat sinks, and active cooling may be required, depending on the
integrated application.
The internal module temperature must be kept to <100
°C when integrated to prevent
damage to the module’s components. For best performance, keep the internal module
temperature below 85°C.
(For acceptance, certification, quality, and production (including RF) test
suggestions, see Testing on page 75.)
- AirPrime MC7304 1
- AM to 5:00 PM Pacific Time 4
- Contents 7
- List of Tables 11
- List of Figures 13
- 1: Introduction 15
- LTE features 17
- Modem features 17
- Position location (GNSS) 18
- Warranty and support 18
- Supporting documents 18
- Accessories 19
- Required connectors 19
- Ordering information 19
- Integration requirements 20
- 2: Standards Compliance 21
- 3: Electrical Specifications 23
- Electrical Specifications 27
- (Continued) 27
- Power supply 30
- USB interface 30
- User-developed drivers 31
- AirPrime 32
- SIM card connector 32
- SIM implementation 33
- Control interface (Signals) 34
- WAN_LED_N—LED output 35
- SYSTEM_RESET_N—Reset Input 36
- PCM/I2S Audio Interface 36
- Figure 3-8: PCM_SYNC timing 37
- 1. Bit clock: 1536 KHz (±10%) 38
- Antenna control 39
- 4: RF Specifications 41
- Antenna and cabling 42
- Ground connection 43
- Interference and sensitivity 43
- Sensitivity vs. frequency 45
- 1. Per 3GPP specification 47
- 1dB Connectorized (Class 3) 48
- GNSS specifications 49
- 5: Power 51
- Module power states 53
- Power state transitions 54
- Power interface 55
- Transmit power waveform (GSM) 56
- Power supply noise 57
- SED (Smart Error Detection) 57
- Tx power control 57
- 6: Software Interface 59
- Device views 62
- Labeling 63
- Electrostatic discharge (ESD) 64
- Module integration testing 65
- Certifications 67
- A: Antenna Specification 69
- Recommended GNSS antenna 71
- Antenna tests 72
- B: Design Checklist 73
- C: Testing 75
- Acceptance test requirements 76
- Acceptance test procedure 76
- Production testing 77
- Functional production test 77
- Production test procedure 78
- +CPIN or +CIMI 79
- LTE RF receive path test 84
- GNSS RF receive path test 86
- Suggested testing equipment 87
- Wireless 87
- IOT/Operator testing 87
- D: Packaging 91
- Command documents 93
- Other Sierra documents 93
- Industry/other documents 93
- F: Technology Overview 95
- DC-HSPA+ 96
- GPRS / EGPRS 96
- G: Acronyms 99
- Wide Area Network 104
- Wireless Local Area Network 104
- Zero Intermediate Frequency 104
- Numerics 105
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